Mobile phone dedicated BGA rework station

Mobile phone dedicated BGA rework station

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X-RAY S-7000


。 Adjust the speed of the stage through the space bar: slow, constant, fast 。 Keyboard control x, y, Z three-axis movement and tilt angle 。 Large navigation window, very clear navigation image, mouse click to move the stage to the point

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X-ray S-7200


。 Adjust the speed of the stage through the space bar: slow, constant, fast 。 Keyboard control x, y, Z three-axis movement and tilt angle 。 Large navigation window, very clear navigation image, mouse click to move the stage to the point

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X-ray S-9200


。 Adjust the speed of the stage through the space bar: slow, constant, fast 。 Keyboard control x, y, Z three-axis movement and tilt angle 。 Large navigation window, very clear navigation image, mouse click to move the stage to the point

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WDS-1250


WDS-A1250 is developed and designed for the repair of large industrial control motherboards and 5G server motherboards (maximum splint area 1200mmX700mm), fully computer controlled. Equipped with high-definition optical alignment system, using infrared + gas (including nitrogen or compressed air) mixed heating method, all action software controls the integrated rework station for welding and demolition completed by the motor drive. Used for desoldering various types of packaging chips. Applicable to any BGA device, special and difficult repair components POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames), etc.

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WDS-900


WDS-900 is a small and large (small size but can be repaired 650mmX610mm large plate) with optical alignment system, using infrared plus gas (including nitrogen or compressed air) mixed heating method, all actions are driven by the motor, software Controlled integrated rework station for desoldering. Used for desoldering various types of packaging chips. Applicable to any BGA device, special and difficult repair components POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, MLF (Micro Lead Frames).

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WDS-800


The integrated design of hot air head and placement head has the functions of automatic placement, automatic welding and automatic disassembly;

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WDS-780


WDS-780 is a precision disassembly and assembly system with an optical alignment system (upper hot air, lower hot air + infrared mixed heating), which is used for rework station for soldering various types of packaging.

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WDS-750


The machine uses a touch screen man-machine interface, heating time, heating temperature, heating speed, cooling time, early warning, vacuum time, etc. are all set inside the touch screen, the operation is intuitive, simple and easy to use;

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WDS-700


The upper and lower temperature zones are heated by hot air, and the temperature is accurately controlled at ± 1 ℃. The upper and lower temperature zones can be heated from the top of the components and the bottom of the PCB at the same time, and 8-stage temperature control can be set at the same time to make the PCB board heated evenly.

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WDS-650


The upper and lower temperature zones are heated by hot air. The IR preheating zone is heated by imported infrared gold-plated light tubes. The temperature rises quickly and the temperature is accurately controlled at ± 1 ℃. 8-stage temperature control can make the PCB board heat evenly, preheat the bottom of the large IR, make the entire PCB temperature even, prevent deformation, ensure the welding effect, and the infrared gold-plated light tube can independently control the heating.

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