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WDS-650

The upper and lower temperature zones are heated by hot air. The IR preheating zone is heated by imported infrared gold-plated light tubes. The temperature rises quickly and the temperature is accurately controlled at ± 1 ℃. 8-stage temperature control can make the PCB board heat evenly, preheat the bottom of the large IR, make the entire PCB temperature even, prevent deformation, ensure the welding effect, and the infrared gold-plated light tube can independently control the heating.

隐藏域元素占位

Classification:

Optical automation BGA rework station

Keywords:

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  • DESCRIPTION
  • technical parameter
  • Features of WDS-650 rework station:

    Independent three temperature zone temperature control system:

    The upper and lower temperature zones are heated by hot air. The IR preheating zone is heated by imported infrared gold-plated light tubes. The temperature rises quickly and the temperature is accurately controlled at ± 1 ℃. 8-stage temperature control can make the PCB board heat evenly, preheat the bottom of the large IR, make the entire PCB temperature even, prevent deformation, ensure the welding effect, and the infrared gold-plated light tube can independently control the heating.

    The upper and lower hot air heating can locally heat the BGA chip and the PCB board at the same time, and then supplement the large area infrared heater to preheat the bottom of the PCB board, which can completely avoid the deformation of the PCB board during the repair process; by selecting Use the upper temperature zone or the lower temperature zone alone, and freely combine the energy of the upper and lower heating elements.

    Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can display four temperature curves and store multiple sets of user data at the same time, and have instant curve analysis function; external temperature measurement interface realizes precise temperature detection and can be used at any time Analyze and proofread the temperature curve of the actual collected BGA. And can carry out curve analysis, setting and correction of temperature parameters at any time on the touch screen;

    Precise optical alignment system: Adopt high-definition digital camera color optical vision alignment system, with functions of splitting, magnifying, reducing, and auto-focusing, and equipped with automatic color difference resolution and brightness adjustment device, which can adjust imaging sharpness; with 15 ″ HD LCD display.

    Multifunctional and humanized operating system

    Adopt high-definition touch screen man-machine interface, integrated design of upper heating device and placement head, equipped with a variety of titanium alloy BGA nozzles, which can be rotated 360 ° at any time, easy to install and replace.

    The X, Y axis and R angles are fine-adjusted with a micrometer, and the alignment is accurate with an accuracy of ± 0.01mm.

    Superior safety protection function: It has an alarm function after welding or de-soldering is completed. In the case of temperature runaway, the circuit can be automatically powered off and has double over-temperature protection function. The temperature parameters are protected by password to prevent arbitrary modification and other safety protection and foolproof functions.

  • WDS-650 product specifications and technical parameters:

    power supply

    Ac220v±10%,50/60hz

    Total power

    5200W

    Heater power

    Upper hot air heating, maximum 1200W

     

    Lower hot air heating, maximum 1200W

     

    Infrared preheating at the bottom, maximum 4000w

    pcb positioning method

    V-shaped card slot + universal fixture + laser positioning lamp for fast positioning.

    Temperature control method

    High-precision K-type thermocouple closed-loop control, independent temperature measurement from top to bottom, temperature accuracy up to plus or minus 1 degree;

    Selection of electrical appliances

    Highly sensitive touch screen + temperature control module + microcontrollers + stepper driver

    Applicable PCB size

    Max410 × 380mm Min 10 × 10 mm

    Applicable chip size

     Max70 × 70mm Min 1 × 1 mm

    Applicable pcb thickness

    0.3-5mm

    Alignment system

    Optical diamond mirror + high-definition industrial camera,

    Mounting accuracy

    ±0.01mm

    Temperature measurement interface

    3

    Mounting maximum load

    150G

    Tin point monitoring

    Optional external camera can be used to monitor the solder ball melting process during welding

    Camera in and out

    Optical lens electric in and out;

    Dimensions

    L600 × W640 × H850mm

    Machine weight

    About 60kg

    Other features

    Five working modes, free switching between automatic / manual mode, 

     

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